MC1558SU
vs
M38510/10104B2X
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
MICROSS COMPONENTS
|
| Package Description |
DIP, DIP8,.3
|
QCCN,
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Average Bias Current-Max (IIB) |
0.5 µA
|
0.003 µA
|
| Common-mode Reject Ratio-Nom |
90 dB
|
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
6000 µV
|
1000 µV
|
| JESD-30 Code |
R-CDIP-T8
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
|
| Length |
10.415 mm
|
|
| Low-Offset |
NO
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-10 V
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
8
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
QCCN
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Slew Rate-Min |
10 V/us
|
|
| Slew Rate-Nom |
20 V/us
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
10 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Unity Gain BW-Nom |
1000
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QLCC
|
| Pin Count |
|
20
|
| Neg Supply Voltage Limit-Max |
|
-22 V
|
| Screening Level |
|
MIL-PRF-38535 Class B
|
| Supply Voltage Limit-Max |
|
22 V
|
|
|
|
Compare MC1558SU with alternatives
Compare M38510/10104B2X with alternatives