MC1741CU vs MC35004BL feature comparison

MC1741CU Freescale Semiconductor

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MC35004BL Motorola Mobility LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS MOTOROLA INC
Package Description DIP, DIP8,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.5 µA 0.0002 µA
Common-mode Reject Ratio-Min 70 dB 80 dB
Common-mode Reject Ratio-Nom 90 dB 100 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 7500 µV 5000 µV
JESD-30 Code R-XDIP-T8 R-GDIP-T14
JESD-609 Code e0 e0
Length 10.415 mm 19.495 mm
Low-Offset NO NO
Neg Supply Voltage Limit-Max -18 V -22 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 4
Number of Terminals 8 14
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies +-15 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Slew Rate-Nom 0.5 V/us 13 V/us
Supply Current-Max 2.8 mA 10 mA
Supply Voltage Limit-Max 18 V 22 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR JFET
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Unity Gain BW-Nom 1000 4000
Voltage Gain-Min 20000 50000
Width 7.62 mm 7.62 mm
Base Number Matches 3 3
Pbfree Code No
Part Package Code DIP
Pin Count 14
ECCN Code EAR99
HTS Code 8542.33.00.01
Bias Current-Max (IIB) @25C 0.0001 µA
Input Offset Current-Max (IIO) 0.04 µA
Low-Bias YES

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