MC26C31P
vs
5962-7802002MFA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
DIP, DIP16,.3
|
DFP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| Differential Output |
YES
|
|
| Driver Number of Bits |
4
|
|
| High Level Input Current-Max |
0.000001 A
|
|
| JESD-30 Code |
R-PDIP-T16
|
R-GDFP-F16
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Out Swing-Min |
2 V
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DFP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Power Supplies |
5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Transmit Delay-Max |
12 ns
|
|
| Base Number Matches |
3
|
4
|
| Part Package Code |
|
DFP
|
| Pin Count |
|
16
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Input Characteristics |
|
DIFFERENTIAL SCHMITT TRIGGER
|
| Interface IC Type |
|
LINE RECEIVER
|
| Interface Standard |
|
GENERAL PURPOSE
|
| Number of Functions |
|
4
|
| Receive Delay-Max |
|
38 ns
|
| Receiver Number of Bits |
|
4
|
| Screening Level |
|
MIL-STD-883
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
|
|
|
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