MC33060AP
vs
MC33060APG
feature comparison
|
MC33060AP
Freescale Semiconductor
Buy Now
|
Buy Now
Datasheet
|
| Source Content uid |
MC33060AP
|
MC33060APG
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
ON SEMICONDUCTOR
|
| Package Description |
DIP, DIP14,.3
|
DIP, DIP14,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
| JESD-30 Code |
R-PDIP-T14
|
R-PDIP-T14
|
| JESD-609 Code |
e0
|
e3
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
0.2 A
|
0.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Switching Frequency-Max |
200 kHz
|
200 kHz
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin (Sn)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| Manufacturer Package Code |
|
646-06
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Analog IC - Other Type |
|
SWITCHING CONTROLLER
|
| Control Technique |
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
|
40 V
|
| Input Voltage-Min |
|
7 V
|
| Input Voltage-Nom |
|
15 V
|
| Length |
|
18.48 mm
|
| Number of Functions |
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Seated Height-Max |
|
4.69 mm
|
| Switcher Configuration |
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
7.62 mm
|
|
|
|
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