MC33074AD
vs
LF147J
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP,
|
CERAMIC, DIP-14
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.7 µA
|
0.05 µA
|
| Common-mode Reject Ratio-Min |
80 dB
|
80 dB
|
| Common-mode Reject Ratio-Nom |
97 dB
|
100 dB
|
| Input Offset Voltage-Max |
5000 µV
|
8000 µV
|
| JESD-30 Code |
R-PDSO-G14
|
R-GDIP-T14
|
| JESD-609 Code |
e0
|
e0
|
| Length |
8.65 mm
|
19.304 mm
|
| Neg Supply Voltage Limit-Max |
-22 V
|
-22 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-20 V
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
5.08 mm
|
| Slew Rate-Min |
8 V/us
|
8 V/us
|
| Slew Rate-Nom |
10 V/us
|
13 V/us
|
| Supply Current-Max |
11.2 mA
|
11 mA
|
| Supply Voltage Limit-Max |
22 V
|
22 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
20 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
4500
|
4000
|
| Voltage Gain-Min |
25000
|
25000
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
5
|
3
|
| Rohs Code |
|
No
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
0.0002 µA
|
| Frequency Compensation |
|
YES
|
| Input Offset Current-Max (IIO) |
|
0.025 µA
|
| Low-Bias |
|
YES
|
| Low-Offset |
|
NO
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
DIP14,.3
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MC33074AD with alternatives
Compare LF147J with alternatives