MC33163PG
vs
MC33165P
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP-16
|
DIP, DIP16,.3
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
648C-04
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
|
| Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
| Control Technique |
PULSE FREQUENCY MODULATION
|
|
| Input Voltage-Max |
40 V
|
|
| Input Voltage-Min |
2.5 V
|
|
| Input Voltage-Nom |
15 V
|
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
| JESD-609 Code |
e3
|
e0
|
| Length |
19.4 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
3.4 A
|
1.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.69 mm
|
|
| Surface Mount |
NO
|
NO
|
| Switcher Configuration |
BOOST
|
|
| Switching Frequency-Max |
55 kHz
|
55 kHz
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
4
|
|
|
|
Compare MC33163PG with alternatives