MC33260DG
vs
MC33260PG
feature comparison
Pbfree Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
ON SEMICONDUCTOR
|
Part Package Code |
SOIC-8 Narrow Body
|
8 LEAD PDIP
|
Package Description |
LEAD FREE, SOIC-8
|
DIP, DIP8,.3
|
Pin Count |
8
|
8
|
Manufacturer Package Code |
751-07
|
626-05
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
4 Weeks
|
Samacsys Manufacturer |
onsemi
|
onsemi
|
Analog IC - Other Type |
POWER FACTOR CONTROLLER
|
POWER FACTOR CONTROLLER
|
Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
16 V
|
16 V
|
Input Voltage-Min |
8.5 V
|
8.5 V
|
Input Voltage-Nom |
13 V
|
13 V
|
JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
JESD-609 Code |
e3
|
e3
|
Length |
4.9 mm
|
9.27 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
0.5 A
|
0.5 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP8,.25
|
DIP8,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
5.33 mm
|
Supply Current-Max (Isup) |
8 mA
|
|
Supply Voltage-Nom (Vsup) |
13 V
|
|
Surface Mount |
YES
|
NO
|
Switcher Configuration |
BOOST
|
BOOST
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin (Sn)
|
Tin (Sn)
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
3.9 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MC33260DG with alternatives
Compare MC33260PG with alternatives