MC33260DR2G
vs
MC33260P
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOTOROLA INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
LEAD FREE, SOIC-8
|
DIP, DIP8,.3
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog IC - Other Type |
POWER FACTOR CONTROLLER
|
POWER FACTOR CONTROLLER
|
| Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
16 V
|
16 V
|
| Input Voltage-Min |
8.5 V
|
11 V
|
| Input Voltage-Nom |
13 V
|
13 V
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
4.9 mm
|
9.78 mm
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
0.5 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.75 mm
|
4.45 mm
|
| Surface Mount |
YES
|
NO
|
| Switcher Configuration |
BOOST
|
SINGLE
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
DIP8,.3
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare MC33260DR2G with alternatives
Compare MC33260P with alternatives