MC33261
vs
581002B02500G
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SPC TECHNOLOGY/ MULTICOMP
|
BOYD CORP
|
| Reach Compliance Code |
unknown
|
compliant
|
| Body Material |
ALUMINUM
|
ALUMINUM
|
| Color |
BLACK
|
BLACK
|
| Construction |
EXTRUDED
|
EXTRUDED
|
| Device Used On |
TRANSISTOR
|
TRANSISTOR
|
| Fin Orientation |
LONGITUDINAL
|
LONGITUDINAL
|
| Finish |
ANODIZED
|
ANODIZED
|
| Height |
25.4 mm
|
25.4 mm
|
| Length |
16.6 mm
|
16.26 mm
|
| Thermal Resistance |
16.7 Ω
|
17.4 Ω
|
| Thermal Support Device Type |
HEAT SINK
|
HEAT SINK
|
| Width |
16.26 mm
|
16.26 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.90.00.00
|
| Factory Lead Time |
|
6 Weeks
|
|
|
|