MC33975TEK vs MC33975TEKR2 feature comparison

MC33975TEK NXP Semiconductors

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MC33975TEKR2 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 0.65 PITCH, ROHS COMPLIANT, SOIC-32 0.65 PITCH, ROHS COMPLIANT, SOIC-32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 39 Weeks 20 Weeks
Samacsys Manufacturer NXP NXP
Interface IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e3 e3
Length 10 mm 10 mm
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 32 32
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HSSOP HSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.45 mm 2.45 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Width 7.5 mm 7.5 mm
Base Number Matches 2 1

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