MC35080U
vs
TL082MJG
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
STMICROELECTRONICS
|
| Package Description |
DIP, DIP8,.3
|
DIP-8
|
| Reach Compliance Code |
unknown
|
unknown
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.05 µA
|
|
| Bias Current-Max (IIB) @25C |
0.0002 µA
|
0.0002 µA
|
| Common-mode Reject Ratio-Nom |
90 dB
|
|
| Frequency Compensation |
YES (AVCL>=2)
|
YES
|
| Input Offset Voltage-Max |
4000 µV
|
9000 µV
|
| JESD-30 Code |
R-XDIP-T8
|
R-XDIP-T8
|
| JESD-609 Code |
e0
|
|
| Length |
10.415 mm
|
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
NO
|
NO
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Power Supplies |
+-15 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Slew Rate-Min |
40 V/us
|
5 V/us
|
| Slew Rate-Nom |
50 V/us
|
|
| Supply Current-Max |
4.2 mA
|
5.6 mA
|
| Supply Voltage Limit-Max |
44 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Unity Gain BW-Nom |
16000
|
3000
|
| Voltage Gain-Min |
15000
|
15000
|
| Width |
7.62 mm
|
|
| Base Number Matches |
3
|
6
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
8
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Input Offset Current-Max (IIO) |
|
0.02 µA
|
| Packing Method |
|
TUBE
|
|
|
|
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