MC40XS6500BEK
vs
MC40XS6500EK
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
SOIC-32
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00
|
8541.29.00
|
| Samacsys Manufacturer |
NXP
|
|
| Built-in Protections |
OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
|
|
| Driver Number of Bits |
5
|
|
| Input Characteristics |
STANDARD
|
|
| Interface IC Type |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-PDSO-G32
|
|
| JESD-609 Code |
e3
|
e3
|
| Length |
11 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
|
| Number of Terminals |
32
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Current Flow Direction |
SINK
|
|
| Output Current-Max |
3.9 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HSSOP
|
|
| Package Equivalence Code |
SSOP32,.4
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
2.45 mm
|
|
| Supply Current-Max |
8 mA
|
|
| Supply Voltage-Max |
18 V
|
|
| Supply Voltage-Min |
7 V
|
|
| Supply Voltage-Nom |
14 V
|
|
| Surface Mount |
YES
|
|
| Terminal Finish |
Tin (Sn)
|
Tin (Sn)
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Turn-off Time |
80 µs
|
|
| Turn-on Time |
80 µs
|
|
| Width |
7.5 mm
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare MC40XS6500BEK with alternatives
Compare MC40XS6500EK with alternatives