MC44BC374TD
vs
MC44BC374BDW
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Package Description |
SOP,
|
SOP, SOP24,.4
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G24
|
| Length |
9.9 mm
|
15.395 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
24
|
| Operating Temperature-Max |
85 °C
|
80 °C
|
| Operating Temperature-Min |
-20 °C
|
-10 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Seated Height-Max |
1.75 mm
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
7.5 mm
|
| Base Number Matches |
4
|
3
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
24
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
SOP24,.4
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
88 mA
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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