MC4558CU vs MC4558ACP1 feature comparison

MC4558CU Freescale Semiconductor

Buy Now Datasheet

MC4558ACP1 Motorola Mobility LLC

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS MOTOROLA INC
Package Description DIP, DIP8,.3 DIP,
Reach Compliance Code unknown unknown
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.5 µA 0.5 µA
Bias Current-Max (IIB) @25C 0.5 µA
Common-mode Reject Ratio-Min 70 dB 70 dB
Common-mode Reject Ratio-Nom 90 dB 90 dB
Frequency Compensation YES
Input Offset Voltage-Max 7500 µV 6000 µV
JESD-30 Code R-XDIP-T8 R-PDIP-T8
JESD-609 Code e0 e0
Length 10.415 mm 9.78 mm
Low-Offset NO
Neg Supply Voltage Limit-Max -18 V -22 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies +-15 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.45 mm
Slew Rate-Min 1 V/us 1.5 V/us
Slew Rate-Nom 1.6 V/us 1.6 V/us
Supply Current-Max 6.7 mA
Supply Voltage Limit-Max 18 V 22 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Unity Gain BW-Nom 2800 2800
Voltage Gain-Min 15000 50000
Width 7.62 mm 7.62 mm
Base Number Matches 3 4
Part Package Code DIP
Pin Count 8
ECCN Code EAR99
HTS Code 8542.33.00.01

Compare MC4558CU with alternatives

Compare MC4558ACP1 with alternatives