MC54F259J vs 933739430602 feature comparison

MC54F259J Motorola Mobility LLC

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933739430602 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description DIP, DIP16,.3 SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
Family F/FAST F/FAST
JESD-30 Code R-GDIP-T16 R-PDSO-G16
JESD-609 Code e0 e4
Length 19.3 mm 9.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type D LATCH J-KBAR FLIP-FLOP
Max I(ol) 0.02 A
Number of Bits 1 1
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supply Current-Max (ICC) 75 mA
Prop. Delay@Nom-Sup 15.5 ns
Propagation Delay (tpd) 8.5 ns 9.2 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.19 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type LOW LEVEL POSITIVE EDGE
Width 7.62 mm 3.9 mm
Base Number Matches 2 1
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
fmax-Min 90 MHz

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