MC54HC00AJ vs 74HC00DR2G feature comparison

MC54HC00AJ Freescale Semiconductor

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74HC00DR2G Rochester Electronics LLC

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS ROCHESTER ELECTRONICS INC
Package Description DIP, DIP14,.3 SOP,
Reach Compliance Code unknown unknown
JESD-30 Code R-XDIP-T14 R-PDSO-G14
JESD-609 Code e0 e3
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.0024 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 55 ns
Qualification Status Not Qualified COMMERCIAL
Schmitt Trigger NO
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
Family HC/UH
Length 8.65 mm
Moisture Sensitivity Level NOT SPECIFIED
Number of Functions 4
Number of Inputs 2
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 110 ns
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 3 V
Time@Peak Reflow Temperature-Max (s) 40
Width 3.9 mm