MC54HC00AJ
vs
MM74HC00J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
FAIRCHILD SEMICONDUCTOR CORP
Package Description
DIP, DIP14,.3
DIP,
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-XDIP-T14
R-GDIP-T14
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.0024 A
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
2/6 V
Prop. Delay@Nom-Sup
55 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
4
Part Package Code
DIP
Pin Count
14
HTS Code
8542.39.00.01
Family
HC/UH
Length
19.43 mm
Number of Functions
4
Number of Inputs
2
Propagation Delay (tpd)
113 ns
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
4.5 V
Width
7.62 mm
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