Findchips: Compare MC54HC00J vs 74HC00D,652

MC54HC00J vs 74HC00D,652 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	ON SEMICONDUCTOR	NXP SEMICONDUCTORS
Part Package Code	DIP	SOIC
Package Description	DIP,	3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Pin Count	14	14
Reach Compliance Code	unknown	compliant
ECCN Code	EAR99	EAR99
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-GDIP-T14	R-PDSO-G14
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
Package Code	DIP	SOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE
Propagation Delay (tpd)	135 ns	135 ns
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	4.5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Position	DUAL	DUAL
Base Number Matches	4	2
Rohs Code		Yes
Manufacturer Package Code		SOT108-1
Samacsys Manufacturer		NXP
JESD-609 Code		e4
Length		8.65 mm
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Package Equivalence Code		SOP14,.25
Packing Method		TUBE
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		27 ns
Schmitt Trigger		NO
Seated Height-Max		1.75 mm
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch		1.27 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		3.9 mm
	Logic » Gates	Logic » Gates