Findchips: Compare MC54HC00J vs 74HC03DB,118

MC54HC00J vs 74HC03DB,118 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	ON SEMICONDUCTOR	NEXPERIA
Part Package Code	DIP	SSOP1
Package Description	DIP,	SSOP-14
Pin Count	14	14
Reach Compliance Code	unknown	compliant
ECCN Code	EAR99
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-GDIP-T14	R-PDSO-G14
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
Package Code	DIP	SSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd)	135 ns	145 ns
Qualification Status	Not Qualified
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	4.5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Position	DUAL	DUAL
Base Number Matches	4	2
Rohs Code		Yes
Manufacturer Package Code		SOT337-1
Date Of Intro		2017-02-01
Samacsys Manufacturer		Nexperia
JESD-609 Code		e4
Length		6.2 mm
Moisture Sensitivity Level		1
Output Characteristics		OPEN-DRAIN
Peak Reflow Temperature (Cel)		260
Seated Height-Max		2 mm
Terminal Finish		NICKEL PALLADIUM GOLD
Terminal Pitch		0.65 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		5.3 mm
	Logic » Gates	Logic » Gates