MC54HC00J vs HD74HC00FP-E feature comparison

MC54HC00J Motorola Semiconductor Products

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HD74HC00FP-E Renesas Electronics Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer MOTOROLA INC RENESAS ELECTRONICS CORP
Package Description DIP, DIP14,.3 SOP,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-PDSO-G14
JESD-609 Code e0
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 135 ns 115 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 4 1
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
Family HC/UH
Length 10.06 mm
Moisture Sensitivity Level 1
Seated Height-Max 2.2 mm
Width 5.5 mm

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