MC54HC00J vs U74HC00L-P14-R feature comparison

MC54HC00J onsemi

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U74HC00L-P14-R Unisonic Technologies Co Ltd

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer ON SEMICONDUCTOR UNISONIC TECHNOLOGIES CO LTD
Part Package Code DIP TSSOP
Package Description DIP, TSSOP,
Pin Count 14 14
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDSO-G14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 135 ns 90 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 4 1
Rohs Code Yes
Length 5 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.0052 A
Package Equivalence Code TSSOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 50 mA
Prop. Delay@Nom-Sup 18 ns
Schmitt Trigger NO
Seated Height-Max 1.2 mm
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm

Compare MC54HC00J with alternatives

Compare U74HC00L-P14-R with alternatives