MC54HC08AJ vs MM74HC08N feature comparison

MC54HC08AJ Motorola Mobility LLC

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MM74HC08N Fairchild Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC FAIRCHILD SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, 0.300 INCH, PLASTIC, MS-001, DIP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-PDIP-T14
JESD-609 Code e0 e3
Length 19.495 mm 19.18 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 22 ns 121 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Manufacturer Package Code 14LD, MDIP,JEDEC MS-001, .300" WIDE
ECCN Code EAR99
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code DIP14,.3
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 35 ns
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) 40

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Compare MM74HC08N with alternatives