Findchips: Compare MC54HC132AJ vs 74HCT00D,653

MC54HC132AJ vs 74HCT00D,653 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	MOTOROLA INC	NXP SEMICONDUCTORS
Package Description	DIP, DIP14,.3	SO-14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HCT
JESD-30 Code	R-GDIP-T14	R-PDSO-G14
JESD-609 Code	e0	e4
Length	19.495 mm	8.65 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Max I(ol)	0.004 A	0.004 A
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
Package Code	DIP	SOP
Package Equivalence Code	DIP14,.3	SOP14,.25
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE
Prop. Delay@Nom-Sup	38 ns	29 ns
Propagation Delay (tpd)	38 ns	29 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	YES	NO
Seated Height-Max	5.08 mm	1.75 mm
Supply Voltage-Max (Vsup)	6 V	5.5 V
Supply Voltage-Min (Vsup)	2 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Finish	TIN LEAD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Pitch	2.54 mm	1.27 mm
Terminal Position	DUAL	DUAL
Width	7.62 mm	3.9 mm
Base Number Matches	3	2
Part Package Code		SOIC
Pin Count		14
Manufacturer Package Code		SOT108-1
Moisture Sensitivity Level		1
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates