MC54HC257JD vs 5962R9580501VX feature comparison

MC54HC257JD Freescale Semiconductor

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5962R9580501VX Intersil Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS HARRIS SEMICONDUCTOR
Package Description DIP, DIP16,.3 DIE,
Reach Compliance Code unknown unknown
JESD-30 Code R-XDIP-T16 S-XUUC-N16
JESD-609 Code e0 e0
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE
Package Body Material CERAMIC UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE UNCASED CHIP
Power Supplies 2/6 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Base Number Matches 3 2
Part Package Code DIE
Pin Count 16
HTS Code 8542.39.00.01
Family HC/UH
Number of Outputs 1
Output Polarity TRUE
Propagation Delay (tpd) 37 ns
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Total Dose 100k Rad(Si) V

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