MC54HCT00AJ vs GD54HCT00J feature comparison

MC54HCT00AJ Motorola Semiconductor Products

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GD54HCT00J LG Semicon Co Ltd

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC LG SEMICON CO LTD
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 1630.6 1630.6
CO2e (mg) 20219.441 20219.441
Family HCT
JESD-30 Code R-GDIP-T14 R-XDIP-T14
JESD-609 Code e0 e0
Length 19.495 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 28 ns 29 ns
Propagation Delay (tpd) 28 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 2

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