MC68181/D
vs
SL6619/KG/TP2Q
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
ZARLINK SEMICONDUCTOR INC
|
Package Description |
LQFP,
|
TQFP,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
Length |
7 mm
|
7 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
70 °C
|
55 °C
|
Operating Temperature-Min |
|
-10 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
TQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
1.2 mm
|
Supply Voltage-Nom |
2 V
|
1.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
BIPOLAR
|
Telecom IC Type |
PAGING DECODER
|
PAGING RECEIVER
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
7 mm
|
7 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
QFP
|
Pin Count |
|
32
|
JESD-609 Code |
|
e3
|
Peak Reflow Temperature (Cel) |
|
260
|
Supply Current-Max |
|
2.4 mA
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare MC68181/D with alternatives
Compare SL6619/KG/TP2Q with alternatives