MC74AC112N vs TC74HC259AFN-TP2 feature comparison

MC74AC112N Motorola Semiconductor Products

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TC74HC259AFN-TP2 Toshiba America Electronic Components

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC TOSHIBA CORP
Package Description DIP, DIP16,.3 SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AC HC/UH
JESD-30 Code R-PDIP-T16 R-PDSO-G16
JESD-609 Code e0
Length 19.175 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type J-K FLIP-FLOP D LATCH
Max Frequency@Nom-Sup 125000000 Hz
Max I(ol) 0.012 A
Number of Bits 2 1
Number of Functions 2 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 13.5 ns 41 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.44 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE LOW LEVEL
Width 7.62 mm 3.9 mm
fmax-Min 125 MHz
Base Number Matches 1 3
Pbfree Code No
Part Package Code SOIC
Pin Count 16
Additional Feature 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare TC74HC259AFN-TP2 with alternatives