MC74AC14DTR2
vs
54F14/B2A
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
|
| Package Description |
TSSOP, TSSOP14,.25
|
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
AC
|
F/FAST
|
| JESD-30 Code |
R-PDSO-G14
|
S-CQCC-N20
|
| JESD-609 Code |
e4
|
|
| Length |
5 mm
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
INVERTER
|
INVERTER
|
| Max I(ol) |
0.012 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
6
|
6
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
14
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
TSSOP
|
QCCN
|
| Package Equivalence Code |
TSSOP14,.25
|
LCC20,.35SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
15 ns
|
|
| Propagation Delay (tpd) |
15 ns
|
9 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
YES
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
4.4 mm
|
|
| Base Number Matches |
2
|
3
|
| Power Supply Current-Max (ICC) |
|
32 mA
|
|
|
|
Compare MC74AC14DTR2 with alternatives
Compare 54F14/B2A with alternatives