MC74AC32DT vs TC74VHC32FN(ELP) feature comparison

MC74AC32DT onsemi

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TC74VHC32FN(ELP) Toshiba America Electronic Components

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Pbfree Code Yes No
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ONSEMI TOSHIBA CORP
Part Package Code TSSOP SOIC
Package Description TSSOP-14 SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family AC AHC/VHC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4
Length 5 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.012 A 0.008 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 10 ns 8.5 ns
Propagation Delay (tpd) 10 ns 8.5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.2 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4.4 mm 3.9 mm
Base Number Matches 4 1
Samacsys Manufacturer Toshiba
Packing Method TR
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MC74AC32DT with alternatives

Compare TC74VHC32FN(ELP) with alternatives