MC74AC32M vs 74AHC32PW,112 feature comparison

MC74AC32M Rochester Electronics LLC

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74AHC32PW,112 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code SOIC TSSOP
Package Description SOP, 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AC AHC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 10.2 mm 5 mm
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 10 ns 14.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.05 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.275 mm 4.4 mm
Base Number Matches 2 2
Manufacturer Package Code SOT402-1
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP14,.25
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 9.5 ns
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) 30

Compare MC74AC32M with alternatives

Compare 74AHC32PW,112 with alternatives