MC74AC32MELG vs HD74LV32AFP feature comparison

MC74AC32MELG Rochester Electronics LLC

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HD74LV32AFP Renesas Electronics Corporation

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Pbfree Code Yes No
Part Life Cycle Code Active Not Recommended
Ihs Manufacturer ROCHESTER ELECTRONICS LLC RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description LEAD FREE, EIAJ, SO-14 SOP,
Pin Count 14 14
Reach Compliance Code unknown compliant
Family AC LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e0
Length 10.2 mm 10.06 mm
Logic IC Type OR GATE OR GATE
Moisture Sensitivity Level NOT SPECIFIED
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 10 ns 19 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 2.05 mm 2.2 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 5.275 mm 5.5 mm
Base Number Matches 2 2
Rohs Code No
HTS Code 8542.39.00.01
Date Of Intro 1999-09-02

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