MC74AC32MELG
vs
TC74VHC32FK
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
TOSHIBA CORP
|
| Part Package Code |
SOIC
|
SSOP
|
| Package Description |
LEAD FREE, EIAJ, SO-14
|
VSSOP, TSSOP14,.16,20
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| Family |
AC
|
AHC/VHC/H/U/V
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e4
|
|
| Length |
10.2 mm
|
4 mm
|
| Logic IC Type |
OR GATE
|
OR GATE
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
VSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Propagation Delay (tpd) |
10 ns
|
13 ns
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
2.05 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| Width |
5.275 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| HTS Code |
|
8542.39.00.01
|
| Samacsys Manufacturer |
|
Toshiba
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.008 A
|
| Package Equivalence Code |
|
TSSOP14,.16,20
|
| Power Supply Current-Max (ICC) |
|
50 mA
|
| Prop. Delay@Nom-Sup |
|
13 ns
|
| Schmitt Trigger |
|
NO
|
|
|
|
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