MC74ACT125N
vs
TC74AC126F(TP2)
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
End Of Life
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
TOSHIBA CORP
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP14,.3
|
SOP,
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Control Type |
ENABLE LOW
|
|
| Family |
ACT
|
AC
|
| JESD-30 Code |
R-PDIP-T14
|
R-PDSO-G14
|
| JESD-609 Code |
e0
|
e0
|
| Length |
18.86 mm
|
10.3 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Max I(ol) |
0.024 A
|
0.024 A
|
| Number of Bits |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP14,.3
|
SOP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Packing Method |
RAIL
|
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Prop. Delay@Nom-Sup |
10 ns
|
|
| Propagation Delay (tpd) |
10 ns
|
8 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.69 mm
|
1.9 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
5.3 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Power Supply Current-Max (ICC) |
|
0.08 mA
|
|
|
|
Compare MC74ACT125N with alternatives
Compare TC74AC126F(TP2) with alternatives