Findchips: Compare MC74F08DR2 vs I74F08D,112

MC74F08DR2 vs I74F08D,112 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Pbfree Code	No
Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	MOTOROLA INC	NXP SEMICONDUCTORS
Part Package Code	SOIC	SOIC
Package Description	SOP,	SOP, DIP14,.3
Pin Count	14	14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	F/FAST	F/FAST
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
JESD-609 Code	e0	e4
Length	8.65 mm	8.65 mm
Load Capacitance (CL)	50 pF
Logic IC Type	AND GATE	AND GATE
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	70 °C	85 °C
Operating Temperature-Min		-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	SOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE
Power Supply Current-Max (ICC)	12.9 mA	12.9 mA
Propagation Delay (tpd)	6.3 ns	6.6 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.75 mm	1.75 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	TTL	TTL
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Finish	TIN LEAD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	DUAL	DUAL
Width	3.9 mm	3.9 mm
Base Number Matches	1	1
Manufacturer Package Code		SOT108-1
Max I(ol)		0.02 A
Moisture Sensitivity Level		1
Package Equivalence Code		DIP14,.3
Packing Method		TUBE
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		6.6 ns
Schmitt Trigger		NO
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates