MC74HC00ADR2 vs MC74HC00ANG feature comparison

MC74HC00ADR2 Rochester Electronics LLC

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MC74HC00ANG Rochester Electronics LLC

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Pbfree Code Yes Yes
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ROCHESTER ELECTRONICS LLC
Part Package Code SOIC DIP
Package Description SOIC-14 LEAD FREE, PLASTIC, DIP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e3 e3
Length 8.65 mm 18.86 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 110 ns 110 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.69 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 3.9 mm 7.62 mm
Base Number Matches 2 1
Rohs Code Yes

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