MC74HC00AF vs MC54HC00J feature comparison

MC74HC00AF Rochester Electronics LLC

Buy Now Datasheet

MC54HC00J Motorola Semiconductor Products

Buy Now Datasheet
Pbfree Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC MOTOROLA INC
Part Package Code SOIC
Package Description EIAJ, SO-14 DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
Family HC/UH
JESD-30 Code R-PDSO-G14 R-XDIP-T14
JESD-609 Code e4 e0
Length 10.2 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level NOT SPECIFIED
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 110 ns 135 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 2.05 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.275 mm
Base Number Matches 2 4
Rohs Code No
HTS Code 8542.39.00.01
Package Equivalence Code DIP14,.3
Schmitt Trigger NO