MC74HC00AN vs SN74HC00ADBRE4 feature comparison

MC74HC00AN Freescale Semiconductor

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SN74HC00ADBRE4 Texas Instruments

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS TEXAS INSTRUMENTS INC
Package Description DIP, DIP14,.3 SSOP,
Reach Compliance Code unknown compliant
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 22 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 4 1
Part Package Code SSOP
Pin Count 14
HTS Code 8542.39.00.01
Family HC/UH
Length 6.2 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Propagation Delay (tpd) 115 ns
Seated Height-Max 2 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Width 5.3 mm

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