MC74HC00AN vs SNJ54HC00J feature comparison

MC74HC00AN Motorola Mobility LLC

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SNJ54HC00J Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer MOTOROLA INC ROCHESTER ELECTRONICS LLC
Part Package Code DIP DIP
Package Description DIP, HERMETIC SEALED, CERAMIC, DIP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-GDIP-T14
JESD-609 Code e0
Length 18.86 mm 19.94 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 22 ns 135 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.69 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 4 2
Pbfree Code No
Additional Feature LG-MAX
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level MIL-PRF-38535
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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