MC74HC00AND vs MM74HC00J feature comparison

MC74HC00AND Freescale Semiconductor

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MM74HC00J Rochester Electronics LLC

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Source Content uid MC74HC00AND
Rohs Code No No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP14,.3 DIP,
Reach Compliance Code unknown unknown
JESD-30 Code R-PDIP-T14 R-GDIP-T14
JESD-609 Code e0 e0
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 19 ns
Schmitt Trigger NO
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 4
Pbfree Code No
Part Package Code DIP
Pin Count 14
HTS Code 8542.39.00.01
Family HC/UH
Length 19.43 mm
Number of Functions 4
Number of Inputs 2
Propagation Delay (tpd) 23 ns
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Width 7.62 mm

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