MC74HC00ANG
vs
74HC00N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
NXP SEMICONDUCTORS
Part Package Code
DIP
MO-001
Package Description
LEAD FREE, PLASTIC, DIP-14
0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
JESD-609 Code
e3
e4
Length
18.86 mm
19.025 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
110 ns
135 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.69 mm
4.2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Finish
MATTE TIN
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
2
ECCN Code
EAR99
Samacsys Manufacturer
NXP
Load Capacitance (CL)
50 pF
Max I(ol)
0.004 A
Package Equivalence Code
DIP14,.3
Packing Method
TUBE
Prop. Delay@Nom-Sup
27 ns
Schmitt Trigger
NO
Compare MC74HC00ANG with alternatives
Compare 74HC00N with alternatives