MC74HC03ADG vs MM54HC03J feature comparison

MC74HC03ADG onsemi

Buy Now Datasheet

MM54HC03J Texas Instruments

Buy Now Datasheet
Pbfree Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ONSEMI NATIONAL SEMICONDUCTOR CORP
Part Package Code SOIC-14 NB
Package Description SOIC-14 DIP, DIP14,.3
Pin Count 14
Manufacturer Package Code 751A-03
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 3 Weeks, 6 Days
Samacsys Manufacturer onsemi
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
JESD-609 Code e3 e0
Length 8.65 mm 19.43 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP14,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 36 ns
Propagation Delay (tpd) 180 ns 37 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 7.62 mm
Base Number Matches 1 5
Rohs Code No

Compare MC74HC03ADG with alternatives

Compare MM54HC03J with alternatives