MC74HC03ADR2G vs M74HC03B1R feature comparison

MC74HC03ADR2G onsemi

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M74HC03B1R STMicroelectronics

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Pbfree Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ONSEMI STMICROELECTRONICS
Part Package Code SOIC-14 NB DIP
Package Description SOIC-14 DIP, DIP14,.3
Pin Count 14 14
Manufacturer Package Code 751A-03
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer onsemi STMicroelectronics
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e3 e3
Length 8.65 mm 19.43 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP14,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 36 ns
Propagation Delay (tpd) 180 ns 90 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 5.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Rohs Code Yes

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