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MC74HC03AFR1 vs 933668750652 feature comparison

MC74HC03AFR1 ON Semiconductor

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933668750652 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ON SEMICONDUCTOR NXP SEMICONDUCTORS
Part Package Code SOIC DIP
Package Description SSOP, DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 6.2 mm 19.025 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Propagation Delay (tpd) 180 ns 135 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 5.3 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Peak Reflow Temperature (Cel) 245
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 40

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