MC74HC03AFR2 vs MM54HC00J feature comparison

MC74HC03AFR2 Rochester Electronics LLC

Buy Now Datasheet

MM54HC00J Rochester Electronics LLC

Buy Now Datasheet
Part Life Cycle Code Active Active
Ihs Manufacturer ROCHESTER ELECTRONICS INC ROCHESTER ELECTRONICS LLC
Part Package Code SOIC DIP
Package Description SSOP, DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
Length 6.2 mm 19.43 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Propagation Delay (tpd) 180 ns 27 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 2 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Width 5.3 mm 7.62 mm
Base Number Matches 2 4
Pbfree Code No
Rohs Code No
HTS Code 8542.39.00.01
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare MM54HC00J with alternatives