MC74HC132ADDR2 vs 74HC132DB,118 feature comparison

MC74HC132ADDR2 Motorola Mobility LLC

Buy Now Datasheet

74HC132DB,118 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code SOIC SSOP1
Package Description SOP, SOT-337-1, SSOP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
kg CO2e/kg 12.4 12.4
Average Weight (mg) 151.15 149.35
CO2e (mg) 1874.26 1851.94
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 38 ns 38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 3.9 mm 5.3 mm
Base Number Matches 2 2
Rohs Code Yes
Manufacturer Package Code SOT337-1
JESD-609 Code e4
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP14,.3
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 38 ns
Schmitt Trigger YES
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

Compare MC74HC132ADDR2 with alternatives

Compare 74HC132DB,118 with alternatives