MC74HC132ADR2G vs TC74HCT00AFN feature comparison

MC74HC132ADR2G onsemi

Buy Now Datasheet

TC74HCT00AFN Toshiba America Electronic Components

Buy Now Datasheet
Pbfree Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ONSEMI TOSHIBA CORP
Part Package Code SOIC-14 NB SOIC
Package Description SOIC-14 SOP, SOP14,.25
Pin Count 14 14
Manufacturer Package Code 751A-03
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 53 Weeks, 5 Days
Samacsys Manufacturer onsemi
Family HC/UH HCT
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e3
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Power Supply Current-Max (ICC) 75 mA
Propagation Delay (tpd) 190 ns 24 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Rohs Code Yes
Additional Feature NOT AVAILABLE IN JAPAN
Max I(ol) 0.004 A
Prop. Delay@Nom-Sup 24 ns

Compare MC74HC132ADR2G with alternatives

Compare TC74HCT00AFN with alternatives