MC74HC132ADTR2G vs M74HC132B1N feature comparison

MC74HC132ADTR2G onsemi

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M74HC132B1N STMicroelectronics

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Pbfree Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ONSEMI STMICROELECTRONICS
Part Package Code TSSOP-14 DIP
Package Description TSSOP-14 DIP, DIP14,.3
Pin Count 14 14
Manufacturer Package Code 948G
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 10 Weeks
Samacsys Manufacturer onsemi
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e4 e0
Length 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Equivalence Code TSSOP14,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 75 mA
Propagation Delay (tpd) 190 ns 31 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES YES
Seated Height-Max 1.2 mm 5.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm 7.62 mm
Base Number Matches 1 1
Rohs Code No
kg CO2e/kg 12.4
Average Weight (mg) 1630.6
CO2e (mg) 20219.441
Max I(ol) 0.004 A
Prop. Delay@Nom-Sup 31 ns

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