MC74HC132AN vs 74HC00DB,112 feature comparison

MC74HC132AN Rochester Electronics LLC

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74HC00DB,112 NXP Semiconductors

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Pbfree Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code DIP SSOP1
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Logic IC Type NAND GATE NAND GATE
Base Number Matches 5 2
Rohs Code Yes
Package Description 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Manufacturer Package Code SOT337-1
Factory Lead Time 4 Weeks
Family HC/UH
JESD-30 Code R-PDSO-G14
JESD-609 Code e4
Length 6.2 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SSOP
Package Equivalence Code SSOP14,.3
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 135 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 2 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm

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