Findchips: Compare MC74HC132AN vs 74HC00DB,118

MC74HC132AN vs 74HC00DB,118 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MOTOROLA INC	NXP SEMICONDUCTORS
Part Package Code	DIP	SSOP1
Package Description	DIP, DIP14,.3	SSOP-14
Pin Count	14	14
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PDIP-T14	R-PDSO-G14
JESD-609 Code	e0	e4
Length	18.86 mm	6.2 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Max I(ol)	0.004 A	0.004 A
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	DIP	SSOP
Package Equivalence Code	DIP14,.3	SSOP14,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	SMALL OUTLINE, SHRINK PITCH
Prop. Delay@Nom-Sup	38 ns	27 ns
Propagation Delay (tpd)	38 ns	135 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	YES	NO
Seated Height-Max	4.69 mm	2 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Finish	Tin/Lead (Sn/Pb)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	THROUGH-HOLE	GULL WING
Terminal Pitch	2.54 mm	0.65 mm
Terminal Position	DUAL	DUAL
Width	7.62 mm	5.3 mm
Base Number Matches	5	2
Rohs Code		Yes
Manufacturer Package Code		SOT337-1
Moisture Sensitivity Level		1
Packing Method		TR
Peak Reflow Temperature (Cel)		260
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates