MC74HC132AND
vs
74HC00D/G,118
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
|
Package Description |
DIP, DIP14,.3
|
3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
|
Reach Compliance Code |
unknown
|
|
JESD-30 Code |
R-PDIP-T14
|
|
JESD-609 Code |
e0
|
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
NAND GATE
|
|
Max I(ol) |
0.004 A
|
|
Number of Terminals |
14
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP14,.3
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Power Supplies |
2/6 V
|
|
Prop. Delay@Nom-Sup |
31 ns
|
|
Schmitt Trigger |
YES
|
|
Surface Mount |
NO
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
|
Base Number Matches |
3
|
2
|
Part Package Code |
|
SOIC
|
Pin Count |
|
14
|
Manufacturer Package Code |
|
SOT108-1
|
|
|
|